Foundry · Company record
SMIC
3 AI chips are made at SMIC, designed by 1 different company.
Process-node breakdown
SMIC's AI chip work, grouped by which manufacturing process was used. Chips whose process isn't public show up under "unspecified".
- SMIC N+2 (~7nm)3 chips
Fastest chips SMIC makes (top 3)
Peak compute per chip, straight from each vendor's datasheet (FP8 where published, otherwise FP16/BF16).
- 1Huawei Ascend 910D2,400 TFLOPSHuawei
- 2Huawei Ascend 910C800 TFLOPSHuawei
- 3Huawei Ascend 910B400 TFLOPSHuawei
All chips SMIC makes, by designer
Huawei3 chips
- Huawei Ascend 910BSMIC N+2 (~7nm)
Huawei's flagship domestic AI training accelerator, positioned as the primary Chinese alternative to Nvidia H100 after US export controls. Uses HBM3, Da Vinci architecture. Widely deployed at Chinese hyperscalers and government cloud regions.
- Huawei Ascend 910CSMIC N+2 (~7nm)
Follow-on to 910B (2024), targeting ~60% of H100 training throughput on Da Vinci 3.0. Volume production ramping despite HBM supply constraints from Samsung/SK Hynix export restrictions.
- Huawei Ascend 910DSMIC N+2 (~7nm)
Announced 2025 as the next generation targeting Nvidia B200 territory. Chiplet architecture per public disclosures; volume production timeline uncertain given SMIC 5nm-equivalent process constraints.
See every foundry or every AI chip we track.