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Partnership

Applied Materials x BE Semiconductor Industries Hybrid Bonding Partnership

Applied Materials purchased 9 percent of BE Semiconductor Industries (Besi) shares in April 2025, building on four years of successful collaboration on hybrid bonding technology for advanced semiconductor packaging. The companies have co-developed an integrated hybrid bonding system combining Applied's wafer processing expertise with Besi's die placement and assembly solutions for high-volume manufacturing.

development · Active · operating


Machine-readable surfaces

c8fdf1fb-a460-4ba0-bfe1-6e5b879414a9
Type
development
Status
Activeoperating

Who’s involved

Applied Materialstechnology provider

Applied Materials is a US-based semiconductor and display manufacturing equipment company. Not a robotics or physical AI entity; included in the registry for context only.

HQUSappliedmaterials.com5 partnerships

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Off-registry parties

  • BE Semiconductor Industries · co developer

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Sources (1)

  1. https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-announces-strategic-investment-be

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